{"version":"1.0","provider_name":"Magazine Office","provider_url":"https:\/\/magazineoffice.com","author_name":"John","author_url":"https:\/\/magazineoffice.com\/author\/nivatsi\/","title":"TSMC apunta a integrar m\u00e1s de 1 bill\u00f3n de transistores en paquetes 3D y 200 mil millones de transistores en chips monol\u00edticos para 2030","type":"rich","width":600,"height":338,"html":"
TSMC apunta a integrar m\u00e1s de 1 bill\u00f3n de transistores en paquetes 3D y 200 mil millones de transistores en chips monol\u00edticos para 2030<\/a><\/blockquote>